3–176
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by inte-
grating the shear–stress strain gauge, temperature com-
pensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic chip
carrier (Case 482). A fluorosilicone gel isolates the die surface
and wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the silicon diaphragm.
The MPXV4115V series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Internal reliability and qualification
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to differ-
ential pressure input. Typical, minimum and maximum out-
put curves are shown for operation over a temperature range
of 0
°
C to 85
°
C using the decoupling circuit shown in Figure 3.
The output will saturate outside of the specified pressure
range.
Figure 2. Cross–Sectional Diagram (Not to Scale)
1.0 F
IPS
470 pF
OUTPUT
Vs
5 V
0.01 F
GND
Vout
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
FLUOROSILICONE
GEL DIE COAT
WIRE BOND
DIFFERENTIAL SENSING
ELEMENT
THERMOPLASTIC
CASE
STAINLESS
STEEL CAP
LEAD
FRAME
P1
P2
DIE BOND
DIE
Figure 4. Applied Vacuum in kPa (below
atmospheric pressure)
MAX
TRANSFER FUNCTION:
Vout = VS*(0.007652*P) + 0.92]
±
(Pressure error
*Temp Factor*0.007652*VS)
VS = 5.0 V
±
0.25 Vdc
TEMP = 0–85
°
C
MIN
–115
–95
–75
–55
–35
–15
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Vout vs. VACUUM
TRANSFER FUNCTION MPXV4115V
O
F
Freescale Semiconductor, Inc.
n
.