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參數(shù)資料
| 型號： | MPC961CFA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 時鐘及定時 |
| 英文描述： | 961 SERIES, PLL BASED CLOCK DRIVER, 17 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32 |
| 封裝： | PLASTIC, LQFP-32 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 159K |
| 代理商： | MPC961CFA |
MPC961C
FREESCALE SEMICONDUCTOR ADVANCED CLOCK DRIVERS DEVICE DATA
489
The feedback trace delay is determined by the board layout
and can be used to fine-tune the effective delay through each
device. In the following example calculation a I/O jitter
confidence factor of 99.7% (
± 3σ) is assumed, resulting in a
worst case timing uncertainty from input to any output of -275
ps to 315 ps relative to CCLK:
tSK(PP) = [-80ps...120ps] + [-150ps...150ps] +
[(15ps @ -3)...(15ps @ 3)] + tPD, LINE(FB)
tSK(PP) = [-275ps...315ps] + tPD, LINE(FB)
can be used for a more precise timing performance analysis.
Figure 8. Max. I/O Jitter versus Frequency
Power Consumption of the MPC961C and Thermal
Management
The MPC961C AC specification is guaranteed for the entire
operating frequency range up to 200 MHz. The MPC961C
power consumption and the associated long-term reliability
may decrease the maximum frequency limit, depending on
operating conditions such as clock frequency, supply voltage,
output loading, ambient temperature, vertical convection and
thermal conductivity of package and board. This section
describes the impact of these parameters on the junction
temperature and gives a guideline to estimate the MPC961C
die junction temperature and the associated device reliability.
For a complete analysis of power consumption as a function of
operating conditions and associated long term device reliability
refer to the Application Note AN1545. According the AN1545,
the long-term device reliability is a function of the die junction
temperature:
Increased power consumption will increase the die junction
temperature and impact the device reliability (MTBF).
According to the system-defined tolerable MTBF, the die
junction temperature of the MPC961C needs to be controlled
and the thermal impedance of the board/package should be
optimized. The power dissipated in the MPC961C is
represented in equation 1.
Where ICCQ is the static current consumption of the
MPC961C, CPD is the power dissipation capacitance per
output,
(Μ)ΣC
L represents the external capacitive output load,
N is the number of active outputs (N is always 27 in case of the
MPC961C). The MPC961C supports driving transmission lines
to maintain high signal integrity and tight timing parameters.
Any transmission line will hide the lumped capacitive load at the
end of the board trace, therefore,
ΣC
L is zero for controlled
transmission line systems and can be eliminated from
equation 1. Using parallel termination output termination results
in equation 2 for power dissipation.
In equation 2, P stands for the number of outputs with a
parallel or thevenin termination, VOL, IOL, VOH, and IOH are a
function of the output termination technique and DCQ is the
clock signal duty cycle. If transmission lines are used
ΣC
L is
zero in equation 2 and can be eliminated. In general, the use of
controlled transmission line techniques eliminates the impact of
the lumped capacitive loads at the end lines and greatly
reduces the power dissipation of the device. Equation 3
describes the die junction temperature TJ as a function of the
power consumption.
Table 8. Confidence Factor CF
CF
Probability of clock edge within the distribution
± 1σ
0.68268948
± 2σ
0.95449988
± 3σ
0.99730007
± 4σ
0.99993663
± 5σ
0.99999943
± 6σ
0.99999999
F_RANGE = 1
F_RANGE = 0
18
16
14
12
10
8
6
4
2
0
50
70
90
110
130
150
170
190
Clock frequency [MHz]
t jit(
φ)
[p
s]
RMS
Table 9. Die Junction Temperature and MTBF
Junction Temperature (
°C)
MTBF (Years)
100
20.4
110
9.1
120
4.2
130
2.0
PTOT = [ ICCQ + VCC fCLOCK ( N CPD + Σ CL ) ] VCC
M
PTOT = VCC [ ICCQ + VCC fCLOCK ( N CPD + Σ CL ) ] + Σ [ DCQ IOH (VCC – VOH) + (1 – DCQ) IOL VOL ]
MP
TJ = TA + PTOT Rthja
fCLOCK,MAX =
CPD N V
2
CC
1
[
– (ICCQ VCC)
]
Rthja
Tj,MAX – TA
Equation 1
Equation 2
Equation 3
Equation 4
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