參數(shù)資料
型號(hào)： MPC875CVR66
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 66 MHz, RISC PROCESSOR, PBGA256
封裝： LEAD FREE, PLASTIC, BGA-256
文件頁數(shù)： 15/84頁
文件大小： 1042K
代理商： MPC875CVR66
MPC875/MPC870 PowerQUICC Hardware Specifications, Rev. 4
22
Freescale Semiconductor
Bus Signal Timing
B30d
WE(0:3)/BS_B[0:3] negated to A(0:31),
BADDR(28:30) invalid GPCM write access
TRLX = 1, CSNT =1, CS negated to A(0:31)
invalid GPCM write access TRLX = 1,
CSNT = 1, ACS = 10 or 11, EBDF = 1
38.67
—
31.38
—
17.83
—
14.19
—
ns
B31
CLKOUT falling edge to CS valid as requested
by control bit CST4 in the corresponding word
in the UPM (MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B31a
CLKOUT falling edge to CS valid as requested
by control bit CST1 in the corresponding word
in the UPM (MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B31b
CLKOUT rising edge to CS valid, as requested
by control bit CST2 in the corresponding word
in the UPM (MAX = 0.00
× B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B31c
CLKOUT rising edge to CS valid, as requested
by control bit CST3 in the corresponding word
in the UPM (MAX = 0.25
× B1 + 6.30)
7.60
13.80
6.30
12.50
3.80
10.00
3.13
9.40
ns
B31d
CLKOUT falling edge to CS valid as requested
by control bit CST1 in the corresponding word
in the UPM EBDF = 1
(MAX = 0.375
× B1 + 6.6)
13.30
18.00
11.30
16.00
7.60
12.30
4.69
11.30
ns
B32
CLKOUT falling edge to BS valid as requested
by control bit BST4 in the corresponding word
in the UPM (MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a
CLKOUT falling edge to BS valid as requested
by control bit BST1 in the corresponding word
in the UPM, EBDF = 0
(MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B32b
CLKOUT rising edge to BS valid, as requested
by control bit BST2 in the corresponding word
in the UPM (MAX = 0.00
× B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c
CLKOUT rising edge to BS valid, as requested
by control bit BST3 in the corresponding word
in the UPM (MAX = 0.25
× B1 + 6.80)
7.60
14.30
6.30
13.00
3.80
10.50
3.13
10.00
ns
B32d
CLKOUT falling edge to BS valid as requested
by control bit BST1 in the corresponding word
in the UPM, EBDF = 1
(MAX = 0.375
× B1 + 6.60)
13.30
18.00
11.30
16.00
7.60
12.30
4.49
11.30
ns
B33
CLKOUT falling edge to GPL valid as
requested by control bit GxT4 in the
corresponding word in the UPM
(MAX = 0.00
× B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
Table 10. Bus Operation Timings (continued)
Num
Characteristic
33 MHz
40 MHz
66 MHz
80 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC875CZT133 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875CZT66 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR133 功能描述:微處理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR66 功能描述:微處理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR80 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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