參數(shù)資料
型號(hào)： MPC857T
廠商： Motorola, Inc.
英文描述： Hardware Specifications
中文描述： 硬件規(guī)格
文件頁(yè)數(shù)： 13/88頁(yè)
文件大?。?/td> 1104K
代理商： MPC857T
MOTOROLA
MPC862/857T/857DSL Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
13
Thermal Calculation and Measurement
7.2
Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
R
θ
JA
= R
θ
JC
+ R
θ
CA
where:
R
θ
JA
= junction-to-ambient thermal resistance (oC/W)
R
θ
JC
= junction-to-case thermal resistance (oC/W)
R
θ
CA
= case-to-ambient thermal resistance (oC/W)
R
θ
JC
is device related and cannot be influenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, R
θ
CA
. For instance, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two resistor
model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the
top of the package. The junction-to-board thermal resistance describes the thermal performance when most
of the heat is conducted to the printed circuit board. It has been observed that the thermal performance of
most plastic packages and especially PBGA packages is strongly dependent on the board temperature; see
Figure 3.
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
0
10
20
30
40
50
60
70
80
90
100
0
20
40
60
80
Board Temperture Rise Above Ambient Divided by Package
Power
J
A
F
Freescale Semiconductor, Inc.
n
.
相關(guān)PDF資料
PDF描述
MPC862P XC2VP20-6FFG896C
MPC862T Hardware Specifications
MPC860 Family Hardware Specifications
MPC855T Family Hardware Specifications
MPC860DE Family Hardware Specifications
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC857TCVR66B 功能描述:微處理器 - MPU POWER QUICC -NO PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC857TCVR80B 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC857TCZQ66B 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC857TCZQ80B 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC857TVR100B 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*