參數(shù)資料
型號： MPC8568ECVTAQGGA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA1023
封裝： 33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1023
文件頁數(shù)： 33/139頁
文件大小： 1449K
代理商： MPC8568ECVTAQGGA
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
128
Freescale Semiconductor
Thermal
The die junction-to-board thermal resistance
Figure 71 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 71. Package with Heat Sink Mounted to a Printed-Circuit Board
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
conducted through the silicon, then through the heat sink attach material (or thermal interface material),
and finally to the heat sink. The junction-to-case thermal resistance is low enough that the heat sink attach
material and heat sink thermal resistance are the dominant terms.
24.2.3
Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 72 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
thermal resistance approximately six times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 69). Therefore, the synthetic grease offers the best thermal performance, especially at the low
interface pressure.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
相關(guān)PDF資料
PDF描述
MPC8568EVTAQGGA 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA1023
MPC8567ECVTAQGGA 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA1023
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MPC8568EVTANGGA 32-BIT, 800 MHz, RISC PROCESSOR, PBGA1023
MPC8567ECVTAUJJA 32-BIT, 1333 MHz, RISC PROCESSOR, PBGA1023
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8568E-MDS-PB 功能描述:開發(fā)板和工具包 - 其他處理器 MPC8568E FAMILY ADS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8568EPXAQGG 功能描述:微處理器 - MPU 8568 PB Encrypt 1GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8568EPXAUJJ 功能描述:微處理器 - MPU 8568 PB Encrypt 1.3GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8568EVTAQGG 功能描述:微處理器 - MPU No PB 1.0 GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8568EVTAUJJ 功能描述:微處理器 - MPU No PB 1.3 GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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