參數(shù)資料
型號: MPC8560PXAPDB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 7/108頁
文件大?。?/td> 2170K
代理商: MPC8560PXAPDB
MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1
104
Freescale Semiconductor
Document Revision History
3.0
Table 1—Corrected MII management voltage reference
Section 2.1.2—New
Table 2—Corrected MII management voltage reference
Table 5—Removed ‘minimum’ column
Table 5—Added AVDD power table
Table 12—Added overshoot/undershoot note.
Table 15—Restated tMCKSKEW1 as tMCKSKEW, removed tMCKSKEW2; added speed-specifc minimum
values for 333, 266, and 200 MHz; updated tDDSHME values.
Updated chapter to reflect that GMII, MII and TBI can be run with 2.5V signalling.
Table 28—Added MDIO output valid timing
Table 30—Updated tLBIVKH1, tLBIXKH1, and tLBOTOT.
Table 31—New
Table 18, Table 20, Table 22—Updated clock reference
Table 33—Updated tTDIVKH
Table 34—Updated tTDKHOX
Added tables and figures for CPM I2C
Table 44—Updated tPCIVKH
Section 14.1— Changed minium height from 2.22 to 3.07 and maximum from 2.76 to 3.75
Table 53.—Updated MII management voltage reference and added note 20.
Section 16.2.4.1—Changed
θ
JC from 0.3 to 0.8; changed die-junction temperature from 67° to 71°
Section 17.7—Added paragraph that begins “TSEC1_TXD[3:0]...”
3.1
Updated Table 4 and Table 5.
Added Table 6.
Added MCK duty cycle to Table 15.
Updated fMDC, tMDC, tMDKHDV, and tMDKHDX parameters in Table 28.
Added LALE to tLBKHOV3 parameter in Table 30 and Table 31, and updated Figure 17 and Figure 18.
Corrected active level designations of some of the pins in Table 53.
Updated Table 62.
Table 61. Document Revision History
Rev. No.
Substantive Change(s)
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