參數(shù)資料
型號: MPC8560PX833LC
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, PLASTIC, FCBGA-783
文件頁數(shù): 22/104頁
文件大小: 1244K
代理商: MPC8560PX833LC
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
24
Freescale Semiconductor
Ethernet: Three-Speed, MII Management
Figure 7 shows the GMII transmit AC timing diagram.
Figure 7. GMII Transmit AC Timing Diagram
7.2.1.2
GMII Receive AC Timing Specifications
Table 22 provides the GMII receive AC timing specifications.
GTX_CLK data clock rise and fall time
tGTXR, tGTXF
2,4
——
1.0
ns
Notes:
1. The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII
transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input
signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect
to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold
time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times,
the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3. Guaranteed by characterization.
4. Guaranteed by design.
Table 22. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
ns
Table 21. GMII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
GTX_CLK
TXD[7:0]
tGTKHDX
tGTX
tGTXH
tGTXR
tGTXF
tGTKHDV
TX_EN
TX_ER
相關PDF資料
PDF描述
MPC8560PXAQFD 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
MPC8560PX833LD 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
MPC8560PX833JB 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
MPC8560PXAQFB 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
MPC8560CPX667JD 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
相關代理商/技術參數(shù)
參數(shù)描述
MPC8560PXAQFB 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PXAQFC 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT833LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324