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參數(shù)資料
| 型號(hào)： | MPC8560CPXALFB |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783 |
| 封裝： | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783 |
| 文件頁(yè)數(shù)： | 102/108頁(yè) |
| 文件大?。?/td> | 2170K |
| 代理商： | MPC8560CPXALFB |
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MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1
Freescale Semiconductor
93
Thermal
Figure 55. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
16.2.4.2Case 2
Every system application has different conditions that the thermal management solution must solve. As an alternate
example, assume that the air reaching the component is 85 °C with an approach velocity of 1 m/sec. For a maximum
junction temperature of 105 °C at 7 W, the total thermal resistance of junction to case thermal resistance plus thermal
interface material plus heat sink thermal resistance must be less than 2.8 °C/W. The value of the junction to case
thermal resistance in Table 59 includes the thermal interface resistance of a thin layer of thermal grease as
documented in footnote 4 of the table. Assuming that the heat sink is flat enough to allow a thin layer of grease or
phase change material, then the heat sink must be less than 2 °C/W.
Millennium Electronics (MEI) has tooled a heat sink MTHERM-1051 for this requirement assuming a compactPCI
environment at 1 m/sec and a heat sink height of 12 mm. The MEI solution is illustrated in Figure 56 and Figure 57.
This design has several significant advantages:
The heat sink is clipped to a plastic frame attached to the application board with screws or plastic inserts at
the corners away from the primary signal routing areas.
The heat sink clip is designed to apply the force holding the heat sink in place directly above the die at a
maximum force of less than 10 lbs.
For applications with significant vibration requirements, silicone damping material can be applied between
the heat sink and plastic frame.
The spring mounting should be designed to apply the force only directly above the die. By localizing the force,
rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to the board to
provide the structure on which the heat sink spring clips. The plastic fence also provides the opportunity to minimize
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
He
a
tSi
n
k
Th
e
rma
lRe
s
is
ta
n
ce
(
°C/W)
(25
× 28 × 15 mm)
2
4
6
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| MPC8560CVT667LB | 功能描述:微處理器 - MPU PQ 3 8560 Dracom RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8560PX667LB | 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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