參數(shù)資料
型號(hào): MPC8555ECPXALE
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁(yè)數(shù): 50/88頁(yè)
文件大小: 1110K
代理商: MPC8555ECPXALE
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
54
Freescale Semiconductor
PCI
Figure 16 provides the AC test load for the I2C.
Figure 37. I2C AC Test Load
Figure 38 shows the AC timing diagram for the I2C bus.
Figure 38. I2C Bus AC Timing Diagram
13 PCI
This section describes the DC and AC electrical specifications for the PCI bus of the MPC8555E.
13.1
PCI DC Electrical Characteristics
Table 41 provides the DC electrical characteristics for the PCI interface of the MPC8555E.
Table 41. PCI DC Electrical Characteristics 1
Parameter
Symbol
Test Condition
Min
Max
Unit
High-level input voltage
VIH
VOUT ≥ VOH (min) or
2
OVDD + 0.3
V
Low-level input voltage
VIL
VOUT ≤ VOL (max)
–0.3
0.8
V
Input current
IIN
VIN
2 = 0 V or V
IN = VDD
—±5
μA
High-level output voltage
VOH
OVDD = min,
IOH = –100 μA
OVDD – 0.2
V
Low-level output voltage
VOL
OVDD = min,
IOL = 100 μA
—0.2
V
Notes:
1. Ranges listed do not meet the full range of the DC specifications of the
PCI 2.2 Local Bus Specifications.
2. Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω
Sr
S
SDA
SCL
tI2CF
tI2SXKL
tI2CL
tI2CH
tI2DXKL
tI2DVKH
tI2SXKL
tI2SVKH
tI2KHKL
tI2PVKH
tI2CR
tI2CF
PS
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