參數(shù)資料
型號： MPC8555ECPXALE
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 5/88頁
文件大?。?/td> 1110K
代理商： MPC8555ECPXALE
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
13
Power Characteristics
3
Power Characteristics
The estimated typical power dissipation for this family of PowerQUICC III devices is shown in Table 4.
Table 4. Power Dissipation(1) (2)
Notes:
1.
2.
CCB Frequency (MHz)
Core Frequency (MHz)
VDD
Typical Power(3)(4) (W)
3.
4.
Maximum Power(5) (W)
5.
200
400
1.2
4.9
6.6
500
1.2
5.2
7.0
600
1.2
5.5
7.3
267
533
1.2
5.4
7.2
667
1.2
5.9
7.7
800
1.2
6.3
9.1
333
667
1.2
6.0
7.9
833
1.2
6.5
9.3
1000(6)
6.
1.3
9.6
12.8
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD.
2. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance. Any customer design must take these considerations into account to ensure the maximum 105 degrees junction
temperature is not exceeded on this device.
3. Typical power is based on a nominal voltage of VDD = 1.2V, a nominal process, a junction temperature of Tj = 105° C, and a
Dhrystone 2.1 benchmark application.
4. Thermal solutions likely need to design to a value higher than Typical Power based on the end application, TA target, and I/O
power
5. Maximum power is based on a nominal voltage of VDD = 1.2V, worst case process, a junction temperature of Tj = 105° C, and
an artificial smoke test.
6. The nominal recommended VDD = 1.3V for this speed grade.
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