參數(shù)資料
型號(hào)： MPC8360ECZUAGDGA
廠商： Freescale Semiconductor
文件頁數(shù)： 85/102頁
文件大小： 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 740-LBGA
供應(yīng)商設(shè)備封裝： 740-TBGA（37.5x37.5）
包裝： 托盤
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
83
System PLL Configuration
ordered, see Section 24.1, “Part Numbers Fully Addressed by this Document,” for part ordering details and contact your
Freescale sales representative or authorized distributor for more information.
21.1
System PLL Configuration
The system PLL is controlled by the RCWL[SPMF] and RCWL[SVCOD] parameters. This table shows the multiplication
factor encodings for the system PLL.
Table 69. Operating Frequencies for the TBGA Package
Characteristic1
400 MHz
533 MHz
667 MHz2
Unit
e300 core frequency (core_clk)
266–400
266–533
266–667
MHz
Coherent system bus frequency (csb_clk)
133–333
MHz
QUICC Engine frequency3 (ce_clk)
266–500
MHz
DDR and DDR2 memory bus frequency (MCLK)4
100–166.67
MHz
Local bus frequency (LCLKn)5
16.67–133
MHz
PCI input frequency (CLKIN or PCI_CLK)
25–66.67
MHz
Security core maximum internal operating frequency
133
166
MHz
Notes:
1. The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk,
MCLK, LCLK[0:2], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies.
2. The 667 MHz core frequency is based on a 1.3 V VDD supply voltage.
3. The 500 MHz QE frequency is based on a 1.3 V VDD supply voltage.
4. The DDR data rate is 2x the DDR memory bus frequency.
5. The local bus frequency is 1/2, 1/4, or 1/8 of the lb_clk frequency (depending on LCRR[CLKDIV]) which is in turn 1× or 2×
the csb_clk frequency (depending on RCWL[LBCM]).
Table 70. System PLL Multiplication Factors
RCWL[SPMF]
System PLL
Multiplication Factor
0000
× 16
0001
Reserved
0010
× 2
0011
× 3
0100
× 4
0101
× 5
0110
× 6
0111
× 7
1000
× 8
1001
× 9
1010
× 10
1011
× 11
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECZUAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUAGFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUAJDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECZUAJDGA 功能描述:微處理器 - MPU 8360 TBGA C ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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