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參數(shù)資料
| 型號： | MPC8360ECZUAGDGA |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 8/102頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II PRO 740TBGA |
| 標(biāo)準(zhǔn)包裝： | 21 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 400MHz |
| 電壓： | 1.2V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 740-LBGA |
| 供應(yīng)商設(shè)備封裝： | 740-TBGA（37.5x37.5） |
| 包裝： | 托盤 |
| 配用： | MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC |
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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
13
Power Sequencing
667
333
500
6.1
6.8
W
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V or 1.3 V, a junction temperature of TJ = 105° C, and a Dhrystone
benchmark application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
5. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU)/500 (QE) with WC process,
a junction TJ = 105° C, and an artificial smoke test.
6. Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 70° C, and a Dhrystone benchmark
application.
7. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU) or 500 (QE) with WC
process, a junction TJ = 70° C, and an artificial smoke test.
8. This frequency combination is only available for rev. 2.0 silicon.
9. This frequency combination is not available for rev. 2.0 silicon.
Table 5. MPC8358E TBGA Core Power Dissipation1
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
266
300
4.1
4.5
W
400
266
400
4.5
5.0
W
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105° C, and a Dhrystone benchmark
application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
Table 4. MPC8360E TBGA Core Power Dissipation1 (continued)
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8360ECZUAGDHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECZUAGFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECZUAGFHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECZUAJDG | 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8360ECZUAJDGA | 功能描述:微處理器 - MPU 8360 TBGA C ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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