參數(shù)資料
型號： MPC8360ECVVAGDGA
廠商： Freescale Semiconductor
文件頁數(shù)： 62/102頁
文件大小： 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 740-LBGA
供應(yīng)商設(shè)備封裝： 740-TBGA（37.5x37.5）
包裝： 托盤
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
62
Freescale Semiconductor
USB DC Electrical Characteristics
19
USB
This section provides the AC and DC electrical specifications for the USB interface of the MPC8360E/58E.
19.1
USB DC Electrical Characteristics
This table provides the DC electrical characteristics for the USB interface.
19.2
USB AC Electrical Specifications
This table describes the general timing parameters of the USB interface of the device.
This figure provide the AC test load for the USB.
Figure 52. USB AC Test Load
Table 64. USB DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
High-level output voltage, IOH = –100 μAVOH
OVDD – 0.4
—
V
Low-level output voltage, IOL = 100 μAVOL
—0.2
V
Input current
IIN
—±10
μA
Table 65. USB General Timing Parameters
Parameter
Symbol1
Min
Max
Unit
Notes
Note
USB clock cycle time
tUSCK
20.83
—
ns
Full speed 48 MHz
—
USB clock cycle time
tUSCK
166.67
—
ns
Low speed 6 MHz
—
Skew between TXP and TXN
tUSTSPN
—5
ns
—
Skew among RXP, RXN, and RXD
tUSRSPND
—
10
ns
Full speed transitions
Skew among RXP, RXN, and RXD
tUSRPND
—
100
ns
Low speed transitions
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(state)(signal) for
receive signals and t(first two letters of functional block)(state)(signal) for transmit signals. For example, tUSRSPND
symbolizes USB timing (US) for the USB receive signals skew (RS) among RXP, RXN, and RXD (PND). Also,
tUSTSPN symbolizes USB timing (US) for the USB transmit signals skew (TS) between TXP and TXN (PN).
2. Skew measurements are done at OVDD/2 of the rising or falling edge of the signals.
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECVVAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAGFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAJDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECVVAJDGA 功能描述:微處理器 - MPU 8360 TBGA C ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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