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參數(shù)資料
| 型號： | MPC8360ECVVAGDGA |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 46/102頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II PRO 740TBGA |
| 標準包裝： | 21 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 400MHz |
| 電壓： | 1.2V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 740-LBGA |
| 供應商設備封裝： | 740-TBGA（37.5x37.5） |
| 包裝： | 托盤 |
| 配用： | MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC |
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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
48
Freescale Semiconductor
I2C AC Electrical Specifications
11.2
I2C AC Electrical Specifications
This table provides the AC timing parameters for the I2C interface of the device.
Table 45. I2C AC Electrical Specifications
Parameter
Symbol1
Min
Max
Unit
Note
SCL clock frequency
fI2C
0
400
kHz
Low period of the SCL clock
tI2CL
1.3
—
μs—
High period of the SCL clock
tI2CH
0.6
—
μs—
Setup time for a repeated START condition
tI2SVKH
0.6
—
μs—
Hold time (repeated) START condition (after this period, the
first clock pulse is generated)
tI2SXKL
0.6
—
μs—
Data setup time
tI2DVKH
100
—
ns
Data hold time:
CBUS compatible masters
I2C bus devices
tI2DXKL
—
02
—
0.93
μs—
Rise time of both SDA and SCL signals
tI2CR
20 + 0.1 Cb
4
300
ns
—
Fall time of both SDA and SCL signals
tI2CF
20 + 0.1 Cb
4
300
ns
—
Set-up time for STOP condition
tI2PVKH
0.6
—
μs—
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
μs—
Noise margin at the LOW level for each connected device
(including hysteresis)
VNL
0.1
× OVDD
—V
—
Noise margin at the HIGH level for each connected device
(including hysteresis)
VNH
0.2
× OVDD
—V
—
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional
block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For
example, tI2DVKH symbolizes I
2C timing (I2) with respect to the time data input signals (D) reach the valid state (V)
relative to the tI2C clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I
2C timing
(I2) for the time that the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock
reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I
2C timing (I2) for the time that the
data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going
to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter:
R (rise) or F (fall).
2. The device provides a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) to
bridge the undefined region of the falling edge of SCL.
3. The maximum tI2DVKH has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4. CB = capacitance of one bus line in pF.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8360ECVVAGDHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAGFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAGFHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAJDG | 功能描述:微處理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8360ECVVAJDGA | 功能描述:微處理器 - MPU 8360 TBGA C ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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