參數(shù)資料
型號(hào): MPC8349ZUAJD
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 533 MHz, RISC PROCESSOR, PBGA672
封裝: 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
文件頁數(shù): 7/108頁
文件大小: 1275K
代理商: MPC8349ZUAJD
MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 7
104
Freescale Semiconductor
Document Revision History
22 Document Revision History
Table 62 provides a revision history of this document.
23 Ordering Information
This section presents ordering information for the device discussed in this document, and it shows an
example of how the parts are marked.
Table 62. Document Revision History
Revision
Date
Substantive Change(s)
7
8/2006
Changed all references to revision 2.0 silicon to revision 3.0 silicon.
Changed VIH minimum value in Table 36, “JTAG Interface DC Electrical Characteristics,” to
OVDD –0.3.
In Table 58, “Suggested PLL Configurations,” deleted reference-number rows 902 and 703.
6
3/2006
Section 2, “Electrical Characteristics,” moved to second section and all other section, table, and
figure numbering change accordingly.
Table 8, “CLKIN AC Timing Specifications”: Changed max rise and fall time from 1.2 to 2.3.
Table 26, “GMII Receive AC Timing Specifications” : Changed min tTTKHDX from 0.5 to 1.0.
Table 34, “MII Management AC Timing Specifications”: Changed max value of tMDKHDX from 70
to 170.
Table 38, “Local Bus General Timing Parameters—DLL on”: Changed min tLBIVKH2 from 1.7 to
2.2.
Table 40, “JTAG interface DC Electrical Characteristics”: Changed VIH input high voltage min to
2.0.
Table 51, “Operating Frequencies for TBGA”:
Updated TBD values.
Changed maximum coherent system bus frequency for TBGA 533-MHz device to 266.
Added Section 23.2, “Part Marking.”
Table 58, “Suggested PLL Configurations”: Removed some values from suggested PLL
configurations for reference numbers 902, 922, 903, and 923.
Table 65, “Part Numbering Nomenclature”: Updated TBD values in note 1.
Added Table 66 “SVR Settings.”
5
10/2005
Table 63: Updated AAVID 30x30x9.4 mm Pin Fin (natural convection) junction-to-ambient thermal
resistance, from 11 to 10.
Changed classification of document to “Technical Data.”
4
9/2005
Added Table 2, "MPC8349E Typical I/O Power Dissipation."
3
8/2005
Table 1: Updated values for power dissipation that were TBD in Revision 2.
2
5/2005
Table 1: Typical values for power dissipation are changed to "TBD".
1
4/2005
Table 1: Addition of note 1
Table 51: Addition of Therm0 (K32)
0
4/2005
Initial release
相關(guān)PDF資料
PDF描述
MPC8349CZUAGD 32-BIT, 400 MHz, RISC PROCESSOR, PBGA672
MPC8349EZUAJD 32-BIT, 533 MHz, RISC PROCESSOR, PBGA672
MPC8358EZQAGDDA 32-BIT, 400 MHz, RISC PROCESSOR, PBGA668
MPC8358CVRADDGA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA668
MPC8358ECVRAGDDA 32-BIT, 400 MHz, RISC PROCESSOR, PBGA668
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8349ZUAJDB 功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8349ZUAJF 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
MPC8349ZUAJFB 功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8349ZUALDB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MPC8349ZUALFB 功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324