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    參數(shù)資料
    

    


    


    
型號(hào)：
MPC8349ZUAJD

    

    
廠商：
FREESCALE SEMICONDUCTOR INC

    

    
元件分類：
微控制器/微處理器

    

    
英文描述：
32-BIT, 533 MHz, RISC PROCESSOR, PBGA672

    

    
封裝：
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672

    

    
文件頁(yè)數(shù)：
105/108頁(yè)

    

    
文件大小：
1275K

    

    
代理商：
MPC8349ZUAJD


    

    

    

	
    
    
    

    
    
	
    MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 7
    96
    Freescale Semiconductor
    Thermal
    Millennium Electronics (MEI)
    408-436-8770
    Loroco Sites
    671 East Brokaw Road
    San Jose, CA 95112
    Internet: www.mei-thermal.com
    Tyco Electronics
    800-522-2800
    Chip Coolers
    P.O. Box 3668
    Harrisburg, PA 17105-3668
    Internet: www.chipcoolers.com
    Wakefield Engineering
    603-635-5102
    33 Bridge St.
    Pelham, NH 03076
    Internet: www.wakefield.com
    Interface material vendors include the following:
    Chomerics, Inc.
    781-935-4850
    77 Dragon Ct.
    Woburn, MA 01801
    Internet: www.chomerics.com
    Dow-Corning Corporation
    800-248-2481
    Dow-Corning Electronic Materials
    P.O. Box 994
    Midland, MI 48686-0997
    Internet: www.dowcorning.com
    Shin-Etsu MicroSi, Inc.
    888-642-7674
    10028 S. 51st St.
    Phoenix, AZ 85044
    Internet: www.microsi.com
    The Bergquist Company
    800-347-4572
    18930 West 78th St.
    Chanhassen, MN 55317
    Internet: www.bergquistcompany.com
    20.3
    Heat Sink Attachment
    When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip.
    The spring clip should connect to the printed circuit board, either to the board itself, to hooks soldered to
    the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the
    package from the board. Such peeling forces reduce the solder joint lifetime of the package. The
    recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive
    attachment should attach to painted or plastic surfaces, and its performance should be verified under the
    application requirements.
    
    
    
    
    
    


    


    

    相關(guān)PDF資料
    		

    PDF描述
    		

    
    

    
MPC8349CZUAGD
32-BIT, 400 MHz, RISC PROCESSOR, PBGA672

    

    
MPC8349EZUAJD
32-BIT, 533 MHz, RISC PROCESSOR, PBGA672

    

    
MPC8358EZQAGDDA
32-BIT, 400 MHz, RISC PROCESSOR, PBGA668

    

    
MPC8358CVRADDGA
32-BIT, 266 MHz, RISC PROCESSOR, PBGA668

    

    
MPC8358ECVRAGDDA
32-BIT, 400 MHz, RISC PROCESSOR, PBGA668

    

    

    

    


    


    

    相關(guān)代理商/技術(shù)參數(shù)
    		

    參數(shù)描述
    		

    
    

    
MPC8349ZUAJDB
功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC8349ZUAJF
功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤

    

    
MPC8349ZUAJFB
功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC8349ZUALDB
 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications

    

    
MPC8349ZUALFB
功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
    
    
    
	
    	
    
    
     
     
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