參數(shù)資料
型號: MPC8323EZQAFDC
廠商: Freescale Semiconductor
文件頁數(shù): 44/82頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 516-PBGA
產(chǎn)品培訓模塊: MPC8323E PowerQUICC II Pro Processor
標準包裝: 40
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 333MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
包裝: 托盤
配用: MPC8323E-RDB-ND - BOARD REFERENCE DESIGN
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
49
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the
information on the PBGA.
21.1
Package Parameters for the MPC8323E PBGA
The package parameters are as provided in the following list. The package type is 27 mm
× 27 mm, 516
PBGA.
Package outline
27 mm
× 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.6 mm
21.2
Mechanical Dimensions of the MPC8323E PBGA
Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
516-PBGA package.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8323EZQAFDCA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications
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MPC8323VRADDCA 制造商:Freescale Semiconductor 功能描述:POWERQUICC, 32 BIT POWER ARCHITECTURE SOC, 266MHZ E300, QE, - Trays 制造商:Freescale Semiconductor 功能描述:IC MPU PWRQUICC 266MHZ 516BGA
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MPC8323VRAFDCA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications