參數(shù)資料
型號: MPC8306VMABDCA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, PBGA369
封裝: 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
文件頁數(shù): 25/76頁
文件大小: 474K
代理商: MPC8306VMABDCA
MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
Freescale Semiconductor
31
TDM/SI
9.2
TDM/SI AC Timing Specifications
Table 29 provides the TDM/SI input and output AC timing specifications.
Figure 20 provides the AC test load for the TDM/SI.
Figure 20. TDM/SI AC Test Load
Table 29. TDM/SI AC Timing Specifications1
Characteristic
Symbol2
Min
Max
Unit
TDM/SI outputs—External clock delay
tSEKHOV
214
ns
TDM/SI outputs—External clock High Impedance
tSEKHOX
210
ns
TDM/SI inputs—External clock input setup time
tSEIVKH
5—
ns
TDM/SI inputs—External clock input hold time
tSEIXKH
2—
ns
Notes:
1. Output specifications are measured from the 50% level of the rising edge of QE_CLK_IN to the 50% level of the signal.
Timings are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI
outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O)
are invalid (X).
Output
Z0 = 50
OVDD/2
RL = 50
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