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參數(shù)資料
| 型號： | MPC8275VR |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerQUICC II Family Hardware Specifications |
| 中文描述： | 的PowerQUICC II系列硬件規(guī)格 |
| 文件頁數(shù)： | 12/76頁 |
| 文件大?。?/td> | 496K |
| 代理商： | MPC8275VR |
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12
MPC8280 PowerQUICC II Family Hardware Specifications
MOTOROLA
Thermal Characteristics
4
Thermal Characteristics
Table 6 describes thermal characteristics for both the packages. See Table 2 for information about a given
device’s package. For the discussions sections 4.1 and 4.2, P
D
= (V
DD
×
I
DD
) + PI/O, where PI/O is the
power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal
Resistance
An estimation of the chip junction temperature, T
J
, in °C can be obtained from the following equation:
T
J
= T
A
+ (R
θ
JA
×
P
D
)
where:
T
A
= ambient temperature (oC)
R
θ
JA
= package junction-to-ambient thermal resistance (oC/W)
P
D
= power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity T
J
–
T
A
) are possible.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
480 TBGA
516 PBGA
Junction to ambient—
single-layer board
1
1
Assumes no thermal vias
2
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
4
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
R
θ
JA
16
27
°
C/W
Natural convection
11
21
1 m/s
Junction to ambient—
four-layer board
R
θ
JA
12
19
°
C/W
Natural convection
9
16
1 m/s
Junction to board
2
R
θ
JB
6
11
°
C/W
—
Junction to case
3
R
θ
JC
2
8
°
C/W
—
Junction-to-package top
4
Ψ
JT
2
2
°
C/W
—
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| MPC8275VRMIBA | 功能描述:微處理器 - MPU 266 MHz 505.4 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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