參數(shù)資料
型號(hào)： MPC8250AZUPIBC
廠商： Freescale Semiconductor
文件頁數(shù)： 55/62頁
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 300MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 480-LBGA
供應(yīng)商設(shè)備封裝： 408-TBGA（37.5x37.5）
包裝： 托盤
MPC8250 Hardware Specifications, Rev. 2
Freescale Semiconductor
59
Ordering Information
6
Ordering Information
Figure 19 provides an example of the Freescale part numbering nomenclature for the MPC8250. In
addition to the processor frequency, the part numbering scheme also consists of a part modifier that
indicates any enhancement(s) in the part from the original production design. Each part number also
contains a revision code that refers to the die mask revision number and is specified in the part numbering
scheme for identification purposes only. For more information, contact your local Freescale sales office.
Figure 19. Freescale Part Number Key
7
Document Revision History
Table 24 provides a revision history for this template.
Table 24. Document Revision History
Revision
Date
Substantive Changes
2
7/2009
Updated TBGA and PBGA packaging information.
1
3/2005
Document template update
0.9
8/2003
Table 2: Modification to supply voltage ranges reflected in notes 2, 3, and 4
Addition of VCCSYN to “Note: Core, PLL, and I/O Supply Voltages” following Table 2
Addition of Figure 2
Addition of note 1 to Table 3
Table 4: Changes to
θJA. Addition of θJB and θJC
Table 7, Figure 8: Addition of sp42a/sp43a
Figure 3 through Figure 8: Addition of notes or modifications
Table 9: Change to sp10
Table 14, Table 16, and Table 18: Removal of PLL bypass mode from clock tables
Table 20 and Table 22: Addition of note 1
Addition of SPICLK to PC19 in Table 20 and Table 22. It is documented correctly in the
MPC8260 PowerQUICC II Family Reference Manual but had previously been omitted from
0.8
11/2002 Table 22, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 53)
0.7
10/2002 Table 22, “VR Pinout”: Addition of L3 to the Core (VDDx) pin list (page 53)
Product Code
Device Number
Process Technology
Package
Processor Frequency
Die Revision Level
MPC 8250 A C
Temperature Range
ZU XXX
(CPU/CPM/Bus)
X
(A = 0.25 micron)
(Blank = 0 to 105 °C
C = –40 to 105 °C)
ZU = 480 TBGA
ZO = 516 PBGA
VV = 480 TBGA (Pb free)
VR = 516 PBGA (Pb free)
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