參數(shù)資料
型號： MPC8250AZUPIBC
廠商： Freescale Semiconductor
文件頁數(shù)： 2/62頁
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 300MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 480-LBGA
供應(yīng)商設(shè)備封裝： 408-TBGA（37.5x37.5）
包裝： 托盤
MPC8250 Hardware Specifications, Rev. 2
10
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
1
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
2
The leakage current is measured for nominal VDD, VCCSYN, and VDD.
Table 4. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
480 TBGA
516 PBGA
Junction to ambient—
single-layer board 1
1
Assumes no thermal vias
θJA
13
24
°C/W
Natural convection
10
18
1 m/s
Junction to ambient—
four-layer board
11
16
Natural convection
813
1 m/s
Junction to board 2
2
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
θJB
48
°C/W
—
Junction to case 3
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
θJC
1.1
6
°C/W
—
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