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參數(shù)資料
| 型號： | MPC8245ARVV400D |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 48/68頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 32BIT 400MHZ 352-TBGA |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 400MHz |
| 電壓： | 2.1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 352-LBGA |
| 供應(yīng)商設(shè)備封裝： | 352-TBGA（35x35） |
| 包裝： | 托盤 |
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MPC8245 Integrated Processor Hardware Specifications, Rev. 10
52
Freescale Semiconductor
System Design
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Selection of an appropriate heat sink depends on thermal performance at a given air velocity, spatial
volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy,
Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances and may or may not need airflow.
7.8.1
Internal Package Conduction Resistance
The intrinsic conduction thermal resistance paths for the TBGA cavity-down packaging technology shown
in Figure 29 are as follows:
Die junction-to-case thermal resistance
Die junction-to-ball thermal resistance
Figure 29 depicts the primary heat transfer path for a package with an attached heat sink mounted on a
printed-circuit board.
Figure 29. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
In a TBGA package, the active side of the die faces the printed-circuit board. Most of the heat travels
through the die, across the die attach layer, and into the copper spreader. Some of the heat is removed from
the top surface of the spreader through convection and radiation. Another percentage of the heat enters the
printed-circuit board through the solder balls. The heat is then removed from the exposed surfaces of the
board through convection and radiation. If a heat sink is used, a larger percentage of heat leaves through
the top side of the spreader.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
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參數(shù)描述 |
|---|---|
| MPC8245ARZU400D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8245ARZU400D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-352 |
| MPC8245ARZU466D | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series |
| MPC8245EC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
| MPC8245ECS02AD | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
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