參數(shù)資料
型號(hào): MPC8245ARVV400D
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, PBGA352
封裝: 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
文件頁(yè)數(shù): 6/68頁(yè)
文件大?。?/td> 1143K
代理商: MPC8245ARVV400D
MPC8245 Integrated Processor Hardware Specifications, Rev. 9
14
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 7 provides the operating frequency information for the MPC8245 at recommended operating
conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V.
4.3.1
Clock AC Specifications
Table 8 provides the clock AC timing specifications at recommended operating conditions, as defined in
Section 4.3.2, “Input AC Timing Specifications.” These specifications are for the default driver strengths
indicated in Table 4.
Table 7. Operating Frequency 1
Characteristic 2, 3
266 MHz
300 MHz
333 MHz
350 MHz
Unit
VDD/AVDD/AVDD2 = 1.7–2.1 V
VDD/AVDD/AVDD2 = 1.9–2.2 V
Processor frequency (CPU)
100–266
100–300
100–333
100–350
MHz
Memory bus frequency
50–133
50–100 4
50–133
50–100 4
MHz
PCI input frequency
25–66
MHz
Notes:
1. For details, refer to the hardware specifications addendum MPC8245ECSO2AD.
2. Caution: The PCI_SYNC_IN frequency and PLL_CFG[0:4] settings must be chosen such that the resulting peripheral
logic/memory bus frequency and CPU (core) frequencies do not exceed their respective maximum or minimum operating
frequencies. Refer to the PLL_CFG[0:4] signal description in Section 6, “PLL Configurations,for valid PLL_CFG[0:4] settings
and PCI_SYNC_IN frequencies.
3. See Table 18 and Table 19 for details on VCO limitations for memory and CPU VCO frequencies of various PLL
configurations.
4. No available PLL_CFG[0:4] settings support 133-MHz memory interface operation at 300- and 350-MHz CPU operation,
since the multipliers do not allow a 300:133 and 350:133 ratio relation. However, running these parts at slower processor
speeds may produce ratios that run above 100 MHz. See Table 18 for the PLL settings.
Table 8. Clock AC Timing Specifications
At recommended operating conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V
Num
Characteristics and Conditions
Min
Max
Unit
Notes
1
Frequency of operation (PCI_SYNC_IN)
25
66
MHz
2, 3
PCI_SYNC_IN rise and fall times
2.0
ns
1
4
PCI_SYNC_IN duty cycle measured at 1.4 V
40
60
%
5a
PCI_SYNC_IN pulse width high measured at 1.4 V
6
9
ns
2
5b
PCI_SYNC_IN pulse width low measured at 1.4 V
6
9
ns
2
7
PCI_SYNC_IN jitter
200
ps
8a
PCI_CLK[0:4] skew (pin-to-pin)
250
ps
8b
SDRAM_CLK[0:3] skew (pin-to-pin)
190
ps
3
10
Internal PLL relock time
100
s
2, 4, 5
15
DLL lock range with DLL_EXTEND = 0 (disabled)
and normal tap delay; (default DLL mode)
ns
6
16
DLL lock range for other modes
See Figure 8 through Figure 10
ns
6
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