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參數(shù)資料
| 型號： | MPC8245ARVV400D |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA352 |
| 封裝： | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352 |
| 文件頁數(shù)： | 5/68頁 |
| 文件大?。?/td> | 1143K |
| 代理商： | MPC8245ARVV400D |
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MPC8245 Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
13
Electrical and Thermal Characteristics
4.2
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8245. For details, see Section 7.8,
4.3
AC Electrical Characteristics
After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 7
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.
Parts are sold by maximum processor core frequency. See Section 9, “Ordering Information,” for details
on ordering parts.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
(Single-layer board—1s)
RθJA
16.1
C/W
1, 2
Junction-to-ambient natural convection
(Four-layer board—2s2p)
RθJMA
12.0
C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Single-layer board—1s)
RθJMA
11.6
C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Four layer board—2s2p)
RθJMA
9.0
C/W
1, 3
Junction-to-board
RθJB
4.8
C/W
4
Junction-to-case
RθJC
1.8
C/W
5
Junction-to-package top (natural convection)
Ψ
JT
1.0
C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1) with the cold plate used for case temperature.
6. Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
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| MPC8245ARZU400D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8245ARZU400D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-352 |
| MPC8245ARZU466D | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series |
| MPC8245EC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
| MPC8245ECS02AD | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
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