參數(shù)資料
型號： MPC8241LZP166B
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
封裝： 25 X 25 MM, 1.27 MM HEIGHT, PLASTIC, BGA-357
文件頁數(shù)： 47/64頁
文件大?。?/td> 827K
代理商： MPC8241LZP166B
MOTOROLA
MPC8241 Integrated Processor Hardware Specifications
51
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
7.7 Thermal Management Information
This section provides thermal management information for the plastic ball grid array (PBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, a heat sink
may be required to maintain junction temperature within specifications. Proper thermal control design is
primarily dependent on the system-level design: heat sink, airflow, and thermal interface material. To reduce
the die-junction temperature, heat sinks may be attached to the package by several methods: adhesive,
spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly (see
Figure 30. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 31 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the PBGA package and a high board level thermal loading from
adjacent components exists (label used—1s).
A heat sink is not attached to the PBGA package and a low board level thermal loading from
adjacent components exists (label used—2s2p).
A large heat sink (cross cut extrusion, 38
× 38 × 16.5 mm) is attached to the PBGA package and a
high board level thermal loading from adjacent components exists (label used—1s/sink).
A large heat sink (cross cut extrusion, 38
× 38 × 16.5 mm) is attached to the PBGA package and a
low board level thermal loading from adjacent components exists (label used—2s2p/sink).
Adhesive or
Thermal Interface
Heat Sink
PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Wire
相關PDF資料
PDF描述
MPC8241LZQ266D 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LZP266B 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ166B 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ266B 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LVR200B 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357
相關代理商/技術參數(shù)
參數(shù)描述
MPC8241LZQ166D 功能描述:微處理器 - MPU 166MHz 315.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 功能描述:微處理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357
MPC8241LZQ266D 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TVR166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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