參數(shù)資料
型號(hào)： MPC755BRX450LE
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 30/52頁(yè)
文件大?。?/td> 1278K
代理商： MPC755BRX450LE
36
MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
Power and ground connections must be made to all external VDD, OVDD, L2OVDD, and GND pins of the
MPC755. Note that power must be supplied to L2OVDD even if the L2 interface of the MPC755 will not be
used; it is recommended to connect L2OVDD to OVDD and L2VSEL to BVSEL if the L2 interface is unused.
(This requirement does not apply to the MPC745 since it has neither an L2 interface nor L2OVDD pins.)
1.8.5
Output Buffer DC Impedance
The MPC755 60x and L2 I/O drivers are characterized over process, voltage, and temperature. To measure
Z0, an external resistor is connected from the chip pad to (L2)OVDD or GND. Then, the value of each
resistor is varied until the pad voltage is (L2)OVDD/2 (see Figure 22).
The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the
pad equals (L2)OVDD/2. RN then becomes the resistance of the pull-down devices. When data is held high,
SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals (L2)OVDD/2. RP then
becomes the resistance of the pull-up devices.
Figure 22 describes the driver impedance measurement circuit described above.
Figure 22. Driver Impedance Measurement Circuit
Alternately, the following is another method to determine the output impedance of the MPC755. A voltage
source, Vforce, is connected to the output of the MPC755 as shown in Figure 23. Data is held low, the voltage
source is set to a value that is equal to (L2)OVDD/2 and the current sourced by Vforce is measured. The
voltage drop across the pull-down device, which is equal to (L2)OVDD/2, is divided by the measured current
to determine the output impedance of the pull-down device, RN. Similarly, the impedance of the pull-up
device is determined by dividing the voltage drop of the pull-up, (L2)OVDD/2, by the current sank by the
pull-up when the data is high and Vforce is equal to (L2)OVDD/2. This method can be employed with either
empirical data from a test setup or with data from simulation models, such as IBIS.
RP and RN are designed to be close to each other in value. Then Z0 = (RP + RN)/2.
Figure 24 describes the alternate driver impedance measurement circuit.
(L2)OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
(L2)OVDD
相關(guān)PDF資料
PDF描述
MPC755CPX400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
MPC745BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC745BVT350 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
MPC755CRX400 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BVT300LE 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
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