參數(shù)資料
型號(hào): MPC7410THX500LE
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 38/56頁(yè)
文件大?。?/td> 0K
描述: IC MPU 32BIT 500MHZ 360-CBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 500MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
43
System Design Information
Figure 27. LGA Package Exploded Cross-Sectional View with Heat Sink Clip to PCB Option
The board designer can choose between several types of heat sinks to place on the MPC7410. There are several
commercially-available heat sinks for the MPC7410 from the following vendors:
Aavid Thermalloy
603-224-9988
70 Commercial Street, Suite 200
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Wakefield Engineering
603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at
a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Thermal
Heat Sink
LGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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