參數(shù)資料
型號: MPC7410THX500LE
廠商: Freescale Semiconductor
文件頁數(shù): 3/56頁
文件大小: 0K
描述: IC MPU 32BIT 500MHZ 360-CBGA
標(biāo)準包裝: 44
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 500MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 5 provides the DC electrical characteristics for the MPC7410.
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the active portion of the die and the calculated case temperature at the top of the die.
The actual value of R JC is less than 0.1 °C/W.
Note: Refer to Section 8.8, “Thermal Management Information,” for details on thermal management.
Table 5. DC Electrical Specifications
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except
SYSCLK)
1.8
VIH
0.65
× (L2)OVDD
(L2)OVDD + 0.2
V
2, 3, 8
2.5
VIH
1.7
(L2)OVDD + 0.2
3.3
VIH
2.0
OVDD + 0.3
Input low voltage (all inputs except
SYSCLK)
1.8
VIL
–0.3
0.35
× (L2)OVDD
V8
2.5
VIL
–0.3
0.2
× (L2)OVDD
3.3
VIL
–0.3
0.8
SYSCLK input high voltage
1.8
CVIH
1.5
OVDD + 0.2
V
2, 8
2.5
CVIH
2.0
OVDD + 0.2
3.3
CVIH
2.4
OVDD + 0.3
SYSCLK input low voltage
1.8
CVIL
–0.3
0.2
V
8
2.5
CVIL
–0.3
0.4
3.3
CVIL
–0.3
0.4
Input leakage current,
Vin = L2OVDD/OVDD
1.8
Iin
—20
A
2, 3,
6, 7
2.5
Iin
—35
3.3
Iin
—70
Table 4. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
相關(guān)PDF資料
PDF描述
IDT70V07S25PF8 IC SRAM 256KBIT 25NS 80TQFP
IDT70261S35PF8 IC SRAM 256KBIT 35NS 100TQFP
IDT70261S25PF8 IC SRAM 256KBIT 25NS 100TQFP
MPC8572ECPXARLD MPU POWERQUICC III 1023-PBGA
IDT70261S20PF8 IC SRAM 256KBIT 20NS 100TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC7410TRX400NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410TRX450NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410VS400LE 功能描述:微處理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410VS400NE 功能描述:微處理器 - MPU REV 1.4 105C LGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410VS450LE 功能描述:微處理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324