參數(shù)資料
型號: MPC7410THX500LE
廠商: Freescale Semiconductor
文件頁數(shù): 29/56頁
文件大小: 0K
描述: IC MPU 32BIT 500MHZ 360-CBGA
標準包裝: 44
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 500MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
35
System Design Information
The MPC7410 generates the clock for the external L2 synchronous data SRAMs by dividing the core clock
frequency of the MPC7410. The divided-down clock is then phase-adjusted by an on-chip delay-lock-loop (DLL)
circuit and should be routed from the MPC7410 to the external RAMs. A separate clock output, L2SYNC_OUT is
sent out half the distance to the SRAMs and then returned as an input to the DLL on pin L2SYNC_IN so that the
rising-edge of the clock as seen at the external RAMs can be aligned to the clocking of the internal latches in the L2
bus interface.
The core-to-L2 frequency divisor for the L2 PLL is selected through the L2CLK bits of the L2CR register. Generally,
the divisor must be chosen according to the frequency supported by the external RAMs, the frequency of the
0111
4.5x
2x
375
(750)
450
(900)
1011
5x
2x
—375
(750)
416
(833)
500
(1000)
1001
5.5x
2x
366
(733)
412
(825)
458
(916)
1101
6x
2x
400
(800)
450
(900)
500
(1000)
0101
6.5x
2x
433
(866)
488
(967)
0010
7x
2x
350
(700)
466
(933)
0001
7.5x
2x
375
(750)
500
(1000)
1100
8x
2x
400
(800)
0000
9x
2x
450
(900)
0011
PLL off/bypass
PLL off, SYSCLK clocks core circuitry directly, 1x bus-to-core implied
1111
PLL off
PLL off, no core clocking occurs
Notes:
1. PLL_CFG[0:3] settings not listed are reserved.
2. The sample bus-to-core frequencies shown are for reference only. Some PLL configurations may select bus, core,
or VCO frequencies which are not useful, not supported, or not tested for by the MPC7410; see Section 4.2.1,
“Clock AC Specifications,for valid SYSCLK, core, and VCO frequencies.
3. In PLL-bypass mode, the SYSCLK input signal clocks the internal processor directly, the PLL is disabled, and the
bus mode is set for 1:1 mode operation. This mode is intended for factory use and third-party emulator tool
development only.
Note: The AC timing specifications given in this document do not apply in PLL-bypass mode.
4. In PLL-off mode, no clocking occurs inside the MPC7410 regardless of the SYSCLK input.
5. PLL-off mode should not be used during chip power-up sequencing.
Table 13. MPC7410 Microprocessor PLL Configuration (continued)
PLL_CFG
[0:3]
Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)
Bus-to-
Core
Multiplier
Core-to
VCO
Multiplier
Bus
33.3 MHz
Bus
50 MHz
Bus
66.6 MHz
Bus
75 MHz
Bus
83.3 MHz
Bus
100 MHz
Bus
133 MHz
相關(guān)PDF資料
PDF描述
IDT70V07S25PF8 IC SRAM 256KBIT 25NS 80TQFP
IDT70261S35PF8 IC SRAM 256KBIT 35NS 100TQFP
IDT70261S25PF8 IC SRAM 256KBIT 25NS 100TQFP
MPC8572ECPXARLD MPU POWERQUICC III 1023-PBGA
IDT70261S20PF8 IC SRAM 256KBIT 20NS 100TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC7410TRX400NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410TRX450NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410VS400LE 功能描述:微處理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410VS400NE 功能描述:微處理器 - MPU REV 1.4 105C LGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410VS450LE 功能描述:微處理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324