參數(shù)資料
型號: MPC7410RX400LD
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 37/52頁
文件大?。?/td> 943K
代理商: MPC7410RX400LD
42
MPC7410 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
Figure 26. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
0
0.5
1
1.5
2
0
1020304050
607080
Silicone Sheet (0.006")
Bare Joint
Floroether Oil Sheet (0.007")
Graphite/Oil Sheet (0.005")
Synthetic Grease
Contact Pressure (psi)
Sp
ec
ifi
c
T
herm
a
lR
e
s
is
tan
ce
(K-in
.2
/W
)
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