參數(shù)資料
型號(hào): MPC603RZT233TX
廠商: MOTOROLA INC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 233 MHz, RISC PROCESSOR, PBGA255
封裝: 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁(yè)數(shù): 8/36頁(yè)
文件大?。?/td> 440K
代理商: MPC603RZT233TX
16
PID7t-603e Hardware Specifications
Pinout Listings
Figure 9. Pinout of the CBGA & PBGA Packages as Viewed from the Top Surface
1.6 Pinout Listings
Table 11 provides the pinout listing for the 603e CBGA and PBGA packages.
Table 11. Pinout Listing for the 255-Pin CBGA and PBGA Packages
Signal Name
Pin Number
Active
I/O
A[0–31]
C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, GO2, E15,
H01, E16, H02, F13, J01, F14, J02, F15, H03, F16, F04, G13, K01, G15,
K02, H16, M01, J15, P01
High
I/O
AACK
L02
Low
Input
ABB
K04
Low
I/O
AP[0–3]
C01, B04, B03, B02
High
I/O
APE
A04
Low
Output
ARTRY
J04
Low
I/O
AVDD
A10
BG
L01
Low
Input
BR
B06
Low
Output
CI
E01
Low
Output
CKSTP_IN
D08
Low
Input
CKSTP_OUT
A06
Low
Output
CLK_OUT
D07
Output
CSE[0–1]
B01, B05
High
Output
DBB
J14
Low
I/O
DBG
N01
Low
Input
DBDIS
H15
Low
Input
DBWO
G04
Low
Input
Part C
Substrate Assembly
Mold Compound
View
Die
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