參數(shù)資料
型號(hào)： MPC603PRX200LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 29/40頁(yè)
文件大小： 156K
代理商： MPC603PRX200LX
PID7v-603e Hardware Specifications
35
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Notes:
1. Junction-to-ambient thermal resistance is based on modeling.
2. Junction-to-heat sink thermal resistance is based on measurements and model using thermal test
chip and thermal couple which is placed on the base of the heat sink.
3.
θ
ja is not measured for 0.25 m/sec convection for the pinn.
The vendors who supply heat sinks are Aavid Engineering, Thermalloy, and Wakeeld Engineering. Any of
these vendors can supply heat sinks with sufcient thermal performance. Refer to Section 1.8.6.1.2,
“Thermal Management Example,” for contact information.
1.8.6.3 Motorola and IBM CBGA Package
The data found in this section concerns 603e’s packaged in the 255-lead 21 mm multi-layer ceramic (MLC),
ceramic BGA package. Data is shown for two cases, the exposed-die case (no heat sink) and using the
Thermalloy 2338-pin n heat sink.
1.8.6.3.1 Thermal Characteristics
The internal thermal resistance for this package is negligible due to the exposed die design. A heat sink is
attached directly to the silicon die surface only when external thermal enhancement is necessary.
Additionally, the CBGA package offers an exceptional thermal connection to the card and power planes.
Heat generated at the chip is dissipated through the package, the heat sink (when used) and the card. The
parallel heat ow paths result in the lowest overall thermal resistance as well as offer signicantly better
power dissipation capability when a heat sink is not used.
1.8.6.3.2 Thermal Management Example
The following example is based on a typical desktop conguration using a solder-bump 21 mm CBGA
package. The heat sink shown is the Thermalloy pinn heat sink #2338 attached directly to the exposed die
with a two-stage thermally conductive epoxy.
The calculations are performed exactly as shown in the previous section.
Figure 17 shows typical thermal performance data for the 21 mm CBGA package mounted to a test card.
相關(guān)PDF資料
PDF描述
MPC603PFE166LX 32-BIT, 166 MHz, RISC PROCESSOR, CQFP240
MPC603PFE200LX 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240
MPC603PFE225LX 32-BIT, 225 MHz, RISC PROCESSOR, CQFP240
MPC603PFE233LX 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240
MPC603PRX225LX 32-BIT, 225 MHz, RISC PROCESSOR, CBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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