參數(shù)資料
型號(hào)： MPC603ERX300LX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 36/36頁(yè)
文件大?。?/td> 551K
代理商： MPC603ERX300LX
PID7t-603e Hardware Specifications
9
Electrical and Thermal Characteristics
Figure 1 provides the SYSCLK input timing diagram.
Figure 1. SYSCLK Input Timing Diagram
1.4.2.2 Input AC Specications
Table 8 provides the input AC timing specications for the PID7t-603e as dened in Figure 2 and Figure 3.
Table 8. Input AC Timing Specifications1
Vdd = AVdd = 2.5 ± 5% V dc, OVdd = 3.3 ± 5% V dc, GND = 0 V dc, 0
Tj 105° C
Num
Characteristic
200, 266, 300 MHz
Unit
Notes
Min
Max
10a
Address/data/transfer attribute inputs valid to SYSCLK (input setup)
2.5
—
ns
2
10b
All other inputs valid to SYSCLK (input setup)
3.5
—
ns
3
10c
Mode select inputs valid to HRESET (input setup)
(for DRTRY, QACK and TLBISYNC)
8—
tsysclk
4, 5, 6, 7
11a
SYSCLK to address/data/transfer attribute inputs invalid (input hold)
1.0
—
ns
2
11b
SYSCLK to all other inputs invalid (input hold)
1.0
—
ns
3
11c
HRESET to mode select inputs invalid (input hold)
(for DRTRY, QACK, and TLBISYNC)
0
—
ns
4, 6, 7
Notes:
1. Input specications are measured from the TTL level (0.8 or 2.0 V) of the signal in question to the 1.4 V of the rising edge
of the input SYSCLK. Input and output timings are measured at the pin.
2. Address/data/transfer attribute input signals are composed of the following—A[0–31], AP[0–3], TT[0–4], TC[0–1], TBST,
TSIZ[0–2], GBL, DH[0–31], DL[0–31], DP[0–7].
3. All other input signals are composed of the following—TS, ABB, DBB, ARTRY, BG, AACK, DBG, DBWO, TA, DRTRY,
TEA, DBDIS, HRESET, SRESET, INT, SMI, MCP, TBEN, QACK, TLBISYNC.
4. The setup and hold time is with respect to the rising edge of HRESET (see Figure 3).
5. tsysclk is the period of the external clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be
multiplied by the period of SYSCLK to compute the actual time duration (in nanoseconds) of the parameter in question.
6. These values are guaranteed by design, and are not tested.
7. This specication is for conguration mode only. Also note that HRESET must be held asserted for a minimum of 255
bus clocks after the PLL-relock time during the power-on reset sequence.
VM
CVil
CVih
SYSCLK
2
3
4
VM = Midpoint Voltage (1.4 V)
4
1
VM
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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