參數(shù)資料
型號(hào)： MPC603ERX300LX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 25/36頁(yè)
文件大?。?/td> 551K
代理商： MPC603ERX300LX
PID7t-603e Hardware Specifications
31
System Design Information
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067-3910
Internet: www.loctite.com
1.8.6.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (qjc + qint + qsa) * Pd
Where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
qjc is the die junction-to-case thermal resistance
qint is the adhesive or interface material thermal resistance
qsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specied in
Table 3. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (Ta) may range from 30 to 40 C. The air temperature rise within a cabinet (Tr) may be in the
range of 5 to 10 C. The thermal resistance of the thermal interface material (
qint) is typically about 1 C/W.
Assuming a Ta of 30 C, a Tr of 5 C a CBGA package qjc = 0.095, and a power consumption (Pd) of 3.0
Watts, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30 C + 5 C + (0.095 C/W + 1.0 C/W + Rsa) * 3.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (Rsa) versus airow
velocity is shown in Figure 18.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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相關(guān)PDF資料
PDF描述
MPC603ERX300TX 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
MPC603PRX233LX 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255
MPC603PRX180LX 32-BIT, 180 MHz, RISC PROCESSOR, CBGA255
MPC603PRX200LX 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
MPC603PFE166LX 32-BIT, 166 MHz, RISC PROCESSOR, CQFP240
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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