- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45344 > MPC603AFE66AC (FREESCALE SEMICONDUCTOR INC) 32-BIT, 66.67 MHz, RISC PROCESSOR, CQFP240 PDF資料下載
參數(shù)資料
| 型號： | MPC603AFE66AC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 66.67 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | 32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件頁數(shù)： | 27/31頁 |
| 文件大?。?/td> | 153K |
| 代理商： | MPC603AFE66AC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁當(dāng)前第27頁第28頁第29頁第30頁第31頁
603 Hardware Specifications
5
Table 2 provides the recommended operating conditions for the 603.
Table 3 provides the package thermal characteristics for the 603.
Table 4 provides the DC electrical characteristics for the 603.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Core supply voltage
Vdd
3.135 to 3.465
V
PLL supply voltage
AVdd
3.135 to 3.465
V
Input voltage
Vin
–0.3 to 5.5
V
Die-junction temperature
Tj
0 to 105
°C
Notes: These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
Table 3. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
Motorola wire-bond CQFP package die junction-to-case thermal resistance (typical)
θ
JC
2.2
°C/W
IBM C4-CQFP package die junction-to-heat sink base thermal resistance (typical)
θ
JS
1.1
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 4. DC Electrical Specifications
Vdd = 3.3
± 5% V dc, GND = 0 V dc, 0 ≤ T
j ≤ 105 °C
Characteristic
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
VIH
2.2
5.5
V
Input low voltage (all inputs except SYSCLK)
VIL
GND
0.8
V
SYSCLK input high voltage
CVIH
2.4
5.5
V
SYSCLK input low voltage
CVIL
GND
0.4
V
Input leakage current, Vin = 3.465 V
Vin = 5.5 V
Iin
—10
A1
Iin
—
TBD
A1
Hi-Z (off-state) leakage current, Vin = 3.465 V
Vin = 5.5 V
ITSI
—10
A1
ITSI
—
TBD
A1
Output high voltage, IOH = –9 mA
VOH
2.4
—
V
AR
CH
IVE
D B
Y F
RE
ES
CA
LE
SE
MI
CO
ND
UC
TO
R,
INC
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC603AFE80CC | RISC PROCESSOR, CQFP240 |
| MPC603AFE66CC | RISC PROCESSOR, CQFP240 |
| MPC603AIP200E | 32-BIT, 200 MHz, RISC PROCESSOR, CPGA288 |
| MPC603CIP200D | 32-BIT, 200 MHz, RISC PROCESSOR, CPGA288 |
| MPC603DIM266E | 32-BIT, 266 MHz, RISC PROCESSOR, CPGA288 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC603AFE80CB | 制造商:Motorola Inc 功能描述: |
| MPC603E | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
| MPC603E7TEC | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
| MPC603E7TED | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
| mpc603efe100ln | 制造商: 功能描述: 制造商:undefined 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。