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參數(shù)資料
| 型號： | MPC603AFE66AC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 66.67 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | 32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件頁數(shù)： | 24/31頁 |
| 文件大小： | 153K |
| 代理商： | MPC603AFE66AC |
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30
603 Hardware Specifications
During the card assembly process, no solvent can be used with the C4FP, and no more than 3 Kg of force
must be applied normal to the top of the package prior to, during, or after card assembly. Other details of
the card assembly process follow:
Solder paste
Either water soluble (for example, Alpha 1208) or no clean
Solder stencil thickness
0.152 mm
Solder stencil aperature
Width reduced to 0.03 mm from the board pad width
Placement tool
Panasonic MPA3 or equivalent
Solder reow
Infrared, convection, or vapor phase
Solder reow prole
Infrared and/or convection
Average ramp-up—0.48 to 1.8
°C/second
Time above 183
°C—45 to 145 seconds
Minimum lead temperature—200
°C
Maximum lead temperature—240
°C
Maximum C4FP temperature—245
°C
Vapor phase
Preheat (board)—60
°C to 150 °C
Time above 183
°C—60 to 145 seconds
Minimum lead temperature—200
°C
Maximum C4FP temperature—220
°C
Egress temperature—below 150
°C
Clean after reow
De-ionized (D.I.) water if water-soluble paste is used
Cleaner requirements—conveyorized, in-line
Minimum of four washing chambers
— Pre-clean chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 70
°C minimum, dwell
time of 24 seconds minimum, water is not re-used, water ow rate
of 30 liters/minute.
— Wash chamber #1: top and bottom sprays, minimum top-side
pressure of 48 psig, minimum bottom-side pressure of 44 psig,
water temperature of 62.5
°C (±2.5 °C), dwell time of 48 seconds
minimum, water ow rate of 350 liters/minute.
— Wash chamber #2: top and bottom sprays, minimum top-side
pressure of 32 psig, minimum bottom-side pressure of 28 psig,
water temperature of 72.5
°C (±2.5 °C), dwell time of 48 seconds
minimum, water ow rate of 325 liters/minute.
— Final rinse chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 72.5
°C minimum, dwell
time of 24 seconds minimum, water ow rate of 30 liters/minute.
No cleaning required if “no clean solder paste” is used
Touch-up and repair
Water soluble (for example, Kester 450) or No Clean Flux
C4FP removal
Hot air rework
C4FP replace
Hand solder
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