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參數(shù)資料
| 型號(hào)： | MPC5606SVMG6 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PBGA208 |
| 封裝： | 17 X 17 MM, 1 MM PITCH, MAPBGA-208 |
| 文件頁(yè)數(shù)： | 93/134頁(yè) |
| 文件大?。?/td> | 890K |
| 代理商： | MPC5606SVMG6 |
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Electrical characteristics
MPC560xS Microcontroller Data Sheet, Rev. 5
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
61
Do not:
— Ground or hand a power/ground supply
— Violate injection current limit per IO/All IO pins as per specifications
— Connect sensitive supplies/ground on noisy supplies/ground (that is, ADC, PLL, and OSC)
— Use SMD supply for generation of noise free supply as these are most noisy lines in the system
— Connect different VDD pins (connected together inside the device) to different potential (that is, VDDE_A)
3.5
Thermal characteristics
3.5.1
General notes for specifications at maximum junction temperature
An estimate of the chip junction temperature, TJ, can be obtained from Equation 1:
TJ = TA + (RJA PD)
Eqn. 1
where:
TA
= ambient temperature for the package (°C)
RJA = junction to ambient thermal resistance (°C/W)
Table 17. LQFP thermal characteristics1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
144-pin 176-pin
RJA
CC D Thermal resistance, junction-to-ambient
natural convection2
2 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board—1s
50
43
°C/W
CC
Four layer board—2s2p
41
35
°C/W
RJMA CC D Thermal resistance, junction-to-moving-air
ambient2
@ 200 ft./min., single layer
board—1s
41
35
°C/W
CC
@ 200 ft./min., four layer
board—2s2p
35
30
°C/W
RJB
CC D Thermal resistance, junction-to-board3
3 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
—29
24
°C/W
RJCtop CC D Thermal resistance, junction-to-case
(top)4
4 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
—10
9
°C/W
JT
CC D Junction-to-package top thermal
characterization parameter, natural
convection5
5 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
—2
2
°C/W
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC5606S
products
in
208
MAPBGA
packages
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