Electrical Characteristics
MPC5567 Microcontroller Data Sheet, Rev. 2
Freescale
17
2 | VDDA0 – VDDA1 | must be < 0.1 V.
3 VPP can drop to 3.0 V during read operations.
4 If standby operation is not required, connect VSTBY to ground.
5 Applies to CLKOUT, external bus pins, and Nexus pins.
6 Maximum average RMS DC current.
7 Average current measured on automotive benchmark. 8 Peak currents can be higher on specialized code.
9 High use current measured while running optimized SPE assembly code with all code and data 100% locked in cache (0% miss rate) with all channels of the
eMIOS and eTPU running autonomously, plus the eDMA transferring data continuously from
SRAM to SRAM. Higher currents are
possible if an idle loop that crosses cache lines is run from cache. Write code to avoid this
condition.
10 The current specification relates to average standby operation after SRAM has been loaded with data. For power up current see 11 Power requirements for the VDD33 supply depend on the frequency of operation, load of all I/O pins, and the voltages on the I/O
segments. Refer to
Table 11 for values to calculate the power dissipation for a specific operation.
12 Power requirements for each I/O segment are dependent on the frequency of operation and load of the I/O pins on a particular I/O
segment, and the voltage of the I/O segment. Refer to
Table 10 for values to calculate power dissipation for specific operation. The
total power consumption of an I/O segment is the sum of the individual power consumptions for each pin on the segment.
13 Absolute value of current, measured at VIL and VIH.
14 Weak pullup/down inactive. Measured at VDDE = 3.6 V and VDDEH = 5.25 V. Applies to pad types: pad_fc, pad_sh, and pad_mh.
15 Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately one-half for each 8 oC
to 12 oC, in the ambient temperature range of 50 oC to 125 oC. Applies to pad types: pad_a and pad_ae.
16 VSSA refers to both VSSA0 and VSSA1. | VSSA0 – VSSA1 | must be < 0.1 V.
17 Up to 0.6 V during power up and power down.