參數(shù)資料
型號(hào)： MPC107ARX066L0
廠商： MOTOROLA INC
元件分類： 外設(shè)及接口
英文描述： MULTIFUNCTION PERIPHERAL, CBGA503
封裝： 32.5 X 32.5 MM, CERAMIC, BGA-503
文件頁數(shù)： 36/44頁
文件大?。?/td> 553K
代理商： MPC107ARX066L0
MPC107 Hardware Specifications (Rev B)
41
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
Document Revision History
Figure 25 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 25. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
For this wire-bond CBGA package, heat generated on the active side of the chip is conducted through the
silicon, the die attach and package spreader, then through the heat sink attach material (or thermal interface
material), and nally to the heat sink where it is removed by forced-air convection.
1.8 Document Revision History
Table 19 provides a revision history for this hardware specication.
Table 19. Document Revision History
Document Revision
Substantive Change(s)
0
Preliminary release with some TBDs in the spec tables.
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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