參數(shù)資料
型號: MMSF3PO3HD
廠商: Motorola, Inc.
英文描述: TMOS P-CHANNEL FIELD EFFECT TRANSISTORS
中文描述: TMOS是P溝道場效應(yīng)晶體管
文件頁數(shù): 1/10頁
文件大小: 329K
代理商: MMSF3PO3HD
1
Motorola, Inc. 1996
Medium Power Surface Mount Products
MiniMOS
devices are an advanced series of power MOSFETs
which utilize Motorola’s High Cell Density HDTMOS process.
These miniature surface mount MOSFETs feature ultra low RDS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain–to–source diode has a very low reverse recovery time.
MiniMOS devices are designed for use in low voltage, high speed
switching applications where power efficiency is important. Typical
applications are dc–dc converters, and power management in
portable and battery powered products such as computers,
printers, cellular and cordless phones. They can also be used for
low voltage motor controls in mass storage products such as disk
drives and tape drives. The avalanche energy is specified to
eliminate the guesswork in designs where inductive loads are
switched and offer additional safety margin against unexpected
voltage transients.
Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life
Logic Level Gate Drive — Can Be Driven by Logic ICs
Miniature SO–8 Surface Mount Package — Saves Board Space
Diode Is Characterized for Use In Bridge Circuits
Diode Exhibits High Speed, With Soft Recovery
IDSS Specified at Elevated Temperature
Avalanche Energy Specified
Mounting Information for SO–8 Package Provided
MAXIMUM RATINGS
(TJ = 25
°
C unless otherwise noted)(1)
Rating
Symbol
VDSS
VDGR
VGS
ID
ID
IDM
PD
Value
30
Unit
Vdc
Drain–to–Source Voltage
Drain–to–Gate Voltage (RGS = 1.0 M
)
Gate–to–Source Voltage — Continuous
Drain Current — Continuous @ TA = 25
°
C
Drain Current
— Continuous @ TA = 100
°
C
Drain Current
— Single Pulse (tp
10
μ
s)
Total Power Dissipation @ TA = 25
°
C (2)
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25
°
C
(VDD = 20 Vdc, VGS = 5.0 Vdc, IL = 9.0 Apk, L = 14
mH, RG = 25
)
Thermal Resistance — Junction to Ambient (2)
Maximum Lead Temperature for Soldering Purposes, 1/8
from case for 10 seconds
DEVICE MARKING
S3P03
(1) Negative signs for P–Channel device omitted for clarity.
(2) Mounted on 2” square FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided), 10 sec. max.
ORDERING INFORMATION
Device
Reel Size
MMSF3P03HDR2
13
12 mm embossed tape
Designer’s Data for “Worst Case” Conditions
— The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s, HDTMOS and MiniMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
30
±
20
4.6
3.0
50
Vdc
Vdc
Adc
Apk
2.5
Watts
°
C
mJ
– 55 to 150
EAS
567
R
θ
JA
TL
50
°
C/W
°
C
260
Tape Width
Quantity
2500 units
Order this document
by MMSF3P03HD/D
SEMICONDUCTOR TECHNICAL DATA
D
S
G
CASE 751–05, Style 13
SO–8
SINGLE TMOS POWER FET
3.0 AMPERES
30 VOLTS
RDS(on) = 0.1 OHM
Motorola Preferred Device
N–C
1
2
3
4
8
7
6
5
Top View
Source
Source
Gate
Drain
Drain
Drain
Drain
Preferred
devices are Motorola recommended choices for future use and best overall value.
REV 5
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