參數(shù)資料
型號(hào)： MMC2080VF001
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： Integrated Processor with Roaming FLEX Decoder
中文描述： 32-BIT, MROM, RISC MICROCONTROLLER, PBGA144
封裝： 12 X 12 MM, 0.80 MM PITCH, MOLD ARRAY PROCESS, BGA-144
文件頁數(shù)： 9/34頁
文件大?。?/td> 768K
代理商： MMC2080VF001
MMC2080/2075 Pin Descriptions
Signal and Connection Descriptions
Preliminary
9
Part 2 Signal and Connection Descriptions
The pins and signals of the MMC2080/2075 are described in the following sections. Figure 3 on page 10
and Figure 4 on page 11 are top and bottom views, respectively, of the 12 mm x 12 mm MAP Ball Grid
Array (BGA) package, and
Figure 5 on page 12
and
Figure 6 on page 13
are top and bottom views,
respectively, of the 43 mm x 43 mm ceramic Pin Grid Array (PGA) package, showing the pin-outs. Table 4
on page 14 and Table 5 on page 17 list the pins by number and signal name.
Figure 7 on page 21 is a representational pin-out of the chip, grouping the signals by their function. Table 6
on page 20 identifies the number of signals for each group and refers to Table 8 on page 23 through Table 20
on page 27, which are organized according to signal type and give a brief description of each signal pin.
2.1 MMC2080/2075 Pin Descriptions
The following section provides information about the available packages for this product, including
diagrams of the package pin-outs and tables describing how the signals of the MMC2080/2075 are allocated.
There are two packages for each part:
The 144-pin I/O, STD small ball (SMBALL) mold array process (MAP) ball grid array (BGA),
12 mm x 12 mm package. Table 4 on page 14 identifies the signal associated with each pin.
The 208-pin I/O, PGA, 43 mm x 43 mm ceramic package. Table 5 on page 17 identifies the signal
associated with each pin.
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