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參數(shù)資料
| 型號： | MM908E625 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication(集成四半H橋，帶電源、嵌入式MCU和LIN串行通信功能) |
| 中文描述： | 綜合四半僅符合電源橋，嵌入式微控制器和LIN串行通信（集成四半魔橋，帶電源，嵌入式微控制器和林串行通信功能） |
| 文件頁數(shù)： | 5/40頁 |
| 文件大?。?/td> | 595K |
| 代理商： | MM908E625 |
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
908E625
5
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage to
the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-State)
Analog Chip Supply Voltage under Transient Conditions (Note 1)
Microcontroller Chip Supply Voltage
V
SUP(
SS
)
V
SUP(
PK
)
V
DD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
V
IN
(ANALOG)
V
IN
(MCU)
-0.3 to 5.5
V
SS
-0.3 to V
DD
+0.3
V
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
I
PIN
(1)
I
PIN
(2)
±15
±25
mA
Maximum Microcontroller V
SS
Output Current
I
MVSS
100
mA
Maximum Microcontroller V
DD
Input Current
I
MVDD
100
mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (Note 1)
V
BUS(SS)
V
BUS(DYNAMIC)
-18 to 28
40
V
ESD Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charge Device Model (Note 4)
V
ESD1
V
ESD2
V
ESD3
±3000
±150
±500
V
THERMAL RATINGS
Storage Temperature
T
STG
-40 to 150
°
C
Operating Case Temperature (Note 5)
T
C
-40 to
85
°
C
Operating Junction Temperature
Analog
MCU
T
J(ANALOG)
T
J(MCU)
-40 to 150
-40 to 125
°
C
Terminal Soldering Temperature (Note 6)
T
SOLDER
245
°
C
Thermal Resistance (Junction to Ambient)
All Outputs ON (Note 7), (Note 9)
Single Output ON (Note 8), (Note 9)
R
θ
JA1
R
θ
JA2
24
27
°
C/W
Notes
1.
2.
3.
4.
5.
6.
Transient capability for pulses with a time of t < 0.5 sec.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
=200 pF,
R
ZAP
=0
).
ESD3 testing is performed in accordance with Charge Device Model, robotic (C
ZAP
=4.0 pF).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
All outputs ON and dissipating equal power.
One output ON and dissipating power.
Per JEDEC JESD51-2 at natural convection, still air condition; and 2s2p thermal test board per JEDEC JESD51-7 and JESD51-5 (thermal
vias connected to top ground plane).
7.
8.
9.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MM908E625ACDWB | 功能描述:8位微控制器 -MCU 32 Bit 8MHz RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| MM908E625ACDWB/R2 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication |
| MM908E625ACEK | 功能描述:8位微控制器 -MCU Quad Half H-Bridge with P/S, HC08, LIN RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| MM908E625ACPEK | 功能描述:8位微控制器 -MCU R0 HI-BRDG EMBED MCU LIN RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| MM908E626 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication |
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