參數(shù)資料
型號: MK60N512VMC100
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121
封裝: 8 X 8 MM, MAPBGA-121
文件頁數(shù): 14/72頁
文件大?。?/td> 1812K
代理商: MK60N512VMC100
4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.3.2 Thermal attributes
Board
type
Symbol Description
121
MAPBGA
81
MAPBGA
80
LQFP
Unit
Notes
Single-
layer (1s)
RθJA
Thermal resistance, junction to ambient
(natural convection)
TBD
°C/W
Four-
layer
(2s2p)
RθJA
Thermal resistance, junction to ambient
(natural convection)
TBD
°C/W
Single-
layer (1s)
RθJMA
Thermal resistance, junction to ambient
(200 ft./min. air speed)
TBD
°C/W
Four-
layer
(2s2p)
RθJMA
Thermal resistance, junction to ambient
(200 ft./min. air speed)
TBD
°C/W
RθJB
Thermal resistance, junction to board
TBD
°C/W
RθJC
Thermal resistance, junction to case
TBD
°C/W
ΨJT
Thermal characterization parameter,
junction to package top outside center
(natural convection)
TBD
°C/W
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
1. output pins
have CL=30pF loads,
Peripheral operating requirements and behaviors
K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
21
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