
MK2731-01
LOW COST VCXO
VCXO
IDT / ICS LOW COST VCXO
3
MK2731-01
REV E 021804
External Component Selection
The MK2731-01 requires a minimum number of external
components for proper operation.
Decoupling Capacitors
Decoupling capacitors of 0.01
F should be connected
between VDD and GND, as close to the MK2731-01 as
possible. For optimum device performance, the decoupling
capacitors should be mounted on the component side of the
PCB. Avoid the use of vias in the decoupling circuit.
Series Termination Resistor
When the PCB traces between the clock outputs and the
loads are over 1 inch, series termination should be used. To
series terminate a 50
trace (a commonly used trace
impedance) place a 33
resistor in series with the clock
line, as close to the clock output pin as possible. The
nominal impedance of the clock output is 20
.
Quartz Crystal
The MK2731-01 VCXO function consists of the external
crystal and the integrated VCXO oscillator circuit. To assure
the best system performance (frequency pull range) and
reliability, a crystal device meeting ICS’ recommended
parameters must be used, and the layout guidelines
discussed in the following section must be followed.
See Application Note MAN05 for a full list of crystal
parameters.
The frequency of oscillation of a quartz crystal is determined
by its “cut” and by the load capacitors connected to it. The
MK2731-01 incorporates on-chip variable load capacitors
that “pull” (change) the frequency of the crystal. The crystal
specified for use with the MK2731-01 is designed to have
zero frequency error when the total of on-chip + stray
capacitance is 14 pF.
The external crystal must be connected as close to the chip
as possible and should be on the same side of the PCB as
the MK2731-01. There should be no via’s between the
crystal pins and the X1 and X2 device pins. There should be
no signal traces underneath or close to the crystal.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small fixed
capacitors, one between X1 and ground, and another
between X2 and ground. Stuffing of these capacitors on the
PCB is optional. The need for these capacitors is
determined at system prototype evaluation, and is
influenced by the particular crystal used (manufacture and
frequency) and by PCB layout. The typical required
capacitor value is 1 to 4 pF.
The procedure for determining the value of these capacitors
can be found in application note MAN05.