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參數(shù)資料
| 型號(hào)： | MIP7965-750MR |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 750 MHz, MICROPROCESSOR, PQFP216 |
| 封裝： | 26 X 26 MM, LEAD FREE, PLASTIC PACKAGE-216 |
| 文件頁數(shù)： | 3/20頁 |
| 文件大小： | 828K |
| 代理商： | MIP7965-750MR |
11
SCD7965 Rev A Preliminary 11/16/05
Aeroflex Plainview
THERMAL INFORMATION
This product is designed to operate over a wide temperature range when used with a heat sink.
Notes
1. Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core.
2.
θJC, the junction-to-case thermal resistance, θJB, the junction-to-board thermal resistance are obtained from Package vendor.
3.
θSA is the thermal resistance of the heat sink to ambient. θCS is the thermal resistance of the heat sink attached material.
Maximum long-term operating junction temperature to ensure adequate long-term life
TBD at 750 MHz
TBD at 668 MHz
Maximum junction temperature for short-term excursions with guaranteed
continued functional performance
TBD at 750 MHz
TBD at 668 MHz
Minimum ambient temperature
TBD
Device Compact Model
2
256-TBGA
θJC (°C/W)
0.43
θJB (°C/W)
2.92
θJA (°C/W)
15.85
216-ExposedPad
θJC (°C/W)
0.28
θJB (°C/W)
2.10
θJA (°C/W)
9.50
208-Lead CQFP F17 & F24
θJC (°C/W)
TBA
θJB (°C/W)
TBA
θJA (°C/W)
TBA
Operating power is dissipated in any package (watts) offered at worst case power supply
Power at 750 MHz
VccInt = 1.3 V, VccIO = 3.3 V
5.0W
Power at 668 MHz
VccInt = 1.3 V, VccIO = 3.3 V
4.5W
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