參數(shù)資料
型號: MCP6V11UT-E/LT
廠商: Microchip Technology
文件頁數(shù): 13/40頁
文件大小: 0K
描述: IC OPAMP SGL ZERO DRIFT SC70-5
標(biāo)準(zhǔn)包裝: 1
放大器類型: 零漂移
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.03 V/µs
增益帶寬積: 80kHz
電流 - 輸入偏壓: 5pA
電壓 - 輸入偏移: 8µV
電流 - 電源: 7.5µA
電流 - 輸出 / 通道: 17mA
電壓 - 電源,單路/雙路(±): 1.6 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: SC-70-5
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: MCP6V11UT-E/LTDKR
MCP6V11/1U
DS25124A-page 20
2012 Microchip Technology Inc.
4.1.3
INTERMODULATION DISTORTION
(IMD)
These op amps will show intermodulation distortion
(IMD) products when an AC signal is present.
The signal and clock can be decomposed into sine
wave tones (Fourier series components). These tones
interact with the zero-drift circuitry’s non-linear
response to produce IMD tones at sum and difference
frequencies. Each of the square wave clock’s
harmonics has a series of IMD tones centered on it.
4.2
Other Functional Blocks
4.2.1
RAIL-TO-RAIL INPUTS
The input stage of the MCP6V11/1U op amps uses two
differential CMOS input stages in parallel. One
operates at low common mode input voltage (VCM,
which is approximately equal to VIN+ and VIN– in
normal operation) and the other at high VCM. With this
topology, the input operates with VCM up to VDD +0.2V,
and down to VSS – 0.15V, at +25°C (see Figure 2-18).
The input offset voltage (VOS) is measured at
VCM =VSS – 0.15V and VDD + 0.2V to ensure proper
operation.
The transition between the input stages occurs when
VCM ≈ VDD –0.9V (see Figure 2-7 and Figure 2-8). For
the best distortion and gain linearity, with non-inverting
gains, avoid this region of operation.
4.2.1.1
Phase Reversal
The input devices are designed to not exhibit phase
inversion when the input pins exceed the supply
voltages.
an
input voltage
exceeding both supplies with no phase inversion.
4.2.1.2
Input Voltage Limits
In order to prevent damage and/or improper operation
of these amplifiers, the circuit must limit the voltages at
). This requirement is independent of the
current limits discussed later on.
The ESD protection on the inputs can be depicted as
shown in Figure 4-4. This structure was chosen to
protect the input transistors against many (but not all)
overvoltage conditions, and to minimize input bias
current (IB).
FIGURE 4-4:
Simplified Analog Input ESD
Structures.
The input ESD diodes clamp the inputs when they try
to go more than one diode drop below VSS. They also
clamp any voltages that well above VDD; their
breakdown voltage is high enough to allow normal
operation, but not low enough to protect against slow
overvoltage (beyond VDD) events. Very fast ESD
events (that meet the spec) are limited so that damage
does not occur.
In some applications, it may be necessary to prevent
excessive voltages from reaching the op amp inputs;
Figure 4-5 shows one approach to protecting these
inputs. D1 and D2 may be small signal silicon diodes,
Schottky diodes for lower clamping voltages or diode
connected FETs for low leakage.
FIGURE 4-5:
Protecting the Analog Inputs
Against High Voltages.
Bond
Pad
Bond
Pad
Bond
Pad
VDD
VIN+
VSS
Input
Stage
Bond
Pad
VIN
V1
VDD
D1
VOUT
V2
D2
U1
MCP6V1X
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