參數(shù)資料
型號: MCP3551E
廠商: Microchip Technology Inc.
英文描述: SENSOR COMP LOAD CELL 2LBF
中文描述: 低功耗,單通道22位Δ-Σ模數(shù)轉換器
文件頁數(shù): 22/30頁
文件大?。?/td> 616K
代理商: MCP3551E
MCP3551/3
DS21950B-page 22
2005 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
α
A2
E1
E
p
B
n
1
2
φ
β
F
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
.037 REF
F
φ
Footprint (Reference)
Foot Angle
Lead Thickness
Notes:
Revised 07-21-05
*
Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Lead Width
β
α
c
B
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016
.024
.118 BSC
.118 BSC
.000
.030
.193 BSC
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
-
-
.009
.016
15°
0.08
0.22
0.23
0.40
15°
15°
MILLIMETERS
*
NOM
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.037
.006
.031
0.40
0.00
0.75
MIN
MAX
1.10
0.95
0.80
0.15
MAX
8
-
-
-
JEDEC Equivalent: MO-187
Drawing No. C04-111
-
-
-
15°
-
-
-
-
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
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