參數(shù)資料
型號(hào): MCP2150DM
廠商: Microchip Technology
文件頁數(shù): 2/52頁
文件大?。?/td> 0K
描述: BOARD DEMO FOR MCP2150
標(biāo)準(zhǔn)包裝: 1
主要目的: 接口,IrDA
嵌入式: 是,MCU,8 位
已用 IC / 零件: MCP2150
主要屬性: 帶 PIC18F MCU 的 IrDA 控制器
次要屬性: USB 接口
已供物品:
產(chǎn)品目錄頁面: 685 (CN2011-ZH PDF)
MCP2150
DS21655B-page 10
Preliminary
2002 Microchip Technology Inc.
2.8
Minimizing Power
The device can be placed in a low power mode by dis-
abling the device (holding the EN pin at the low state).
The internal state machine is monitoring this pin for a
low level and, once this is detected, the device is
disabled and enters into a low power state.
2.8.1
RETURNING TO DEVICE
OPERATION
When disabled, the device is in a low power state.
When the EN pin is brought to a high level, the device
will return to the operating mode. The device requires
a delay of 1024 TOSC before data may be transmitted
or received.
2.9
Network Layering Reference
Model
Figure 2-5 shows the ISO Network Layering Reference
Model. The shaded areas are implemented by the
MCP2150, the cross-hatched area is implemented by
an infrared transceiver. The unshaded areas should be
implemented by the Host Controller.
FIGURE 2-5:
ISO REFERENCE LAYER MODEL
OSI REFERENCE LAYERS
Application
Presentation
Session
Transport
Network
Data Link Layer
LLC (Logical Link Control)
Acceptance Filtering
Overload Notification
Recovery Management
MAC (Medium Access Control)
Data Encapsulation/Decapsulation
Frame Coding (stuffing, destuffing)
Medium Access Management
Error Detection
Error Signalling
Acknowledgment
Serialization/Deserialization
Physical Layer
PLS (Physical Signalling)
Bit Encoding/Decoding
Bit Timing
Synchronization
PMA (Physical Medium Attachment)
Driver/Receiver Characteristics
MDI (Medium Dependent Interface)
Connectors
Fault
confinement
(MAC-LME)
Bus Failure
management
(PLS-LME)
Supervisor
Regions implemented
by the MCP2150
Has to be implemented in Host
Controller firmware
Regions implemented
by the Optical Transceiver logic
(such as a PICmicro
microcontroller)
相關(guān)PDF資料
PDF描述
GBM10DRSN-S664 CONN EDGECARD 20POS DIP .156 SLD
CB5278-000 HEAT SHRINK TUBING
ELC-10D390E COIL CHOKE 39UH RADIAL
CB5270-000 HEAT SHRINK TUBING
VI-BWV-EX CONVERTER MOD DC/DC 5.8V 75W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP2150-I/P 功能描述:輸入/輸出控制器接口集成電路 IrDA protocol handlr RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray
MCP2150-I/P 制造商:Microchip Technology Inc 功能描述:IC IRDA CONTROLLER 2150 DIP18
MCP2150-I/SO 功能描述:輸入/輸出控制器接口集成電路 IrDA protocol handlr RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray
MCP2150-I/SO 制造商:Microchip Technology Inc 功能描述:IRDA CONTROLLER SMD 2150 SOIC18
MCP2150-I/SORVB 制造商:Microchip 功能描述:MCP2150 Series 115.2 kBaud 64 Byte Standard Protocol Stack Controller - SOIC-18