i.MX27 and i.MX27L Data Sheet, Rev. 1.8
42
Freescale Semiconductor
Electrical Characteristics
Table 9 provides information for interface frequency limits.
4.1.2
Current Consumption
Table 10 defines the frequency settings used for specifying power consumption in
Table 11. All power
states are specified. The temperature setting of 25
° C is used for specifying the Deep Sleep Mode (DSM)
per the temperature range shown in
Table 7.
Table 11 shows the power consumption for the i.MX27/iMX27L device.
Table 9. Interface Frequency
ID
Parameter
Symbol
Min
Typical
Max
Units
1
JTAG: TCK Frequency of Operation
fJTAG
DC
5
33.25
MHz
Table 10. Frequency Definition for Power Consumption Measurement
ID
Parameter
Symbol
Value
Units
1
MCU core
fMCUmeas@266
266
MHz
2
MCU core
fMCUmeas@400
400
MHz
3
MCU AHB bus
fMCU-AHBmeas
133
MHz
4
MCU IP bus
fMCU-IPmeas
66
MHz
5OSC32
fosc32khzmeas
32.768
kHz
Table 11. Current Consumption
ID
Parameter
Conditions
Symbol
Typical
Max
Units
1
RUN Current
(QVDD current)
RUN Current at 266 MHz
QVDD = 1.3 V. Ta = 25
oC
IddRUN
215
260
mA
RUN Current at 400 MHz
QVDD = 1.45 V, Ta = 25
oC
IddRUN
366
420
mA
2
Doze Current
QVDD = 1.2 V
NVDD = 1.75 V
ARM is in wait for interrupt mode.
ARM well bias is enabled.
MCU PLL is on.
SPLL is off.
FPM is on.
26 MHz oscillator is on.
32 kHz oscillator is on.
Other modules are off.
TA = 25° C.
IddDOZE
11
13.5
mA
