參數(shù)資料
型號： MCF54418CMJ250
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, PBGA256
封裝： 12 X 12 MM, ROHS COMPLAINT, MAPBGA-256
文件頁數(shù)： 14/60頁
文件大?。?/td> 1107K
代理商： MCF54418CMJ250
Electrical characteristics
MCF5441x ColdFire Microprocessor Data Sheet, Rev. 6
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
21
4.2
Thermal characteristics
The average chip-junction temperature (TJ) in C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature, C
QJMA
= Package Thermal Resistance, Junction-to-Ambient, C/W
PD
=PINT + PI/O
PINT
=IDD IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
Table 7. Thermal characteristics
Characteristic
Symbol
196
MAPBGA
256
MAPBGA
Unit
Junction to ambient, natural convection1,2
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
2 Per JEDEC JESD51-6 with the board horizontal.
Four layer board
(2s2p)
JA
TBD
32
C/W
Junction to ambient (@200 ft/min)1,2
Four layer board
(2s2p)
JMA
TBD
29
C/W
Junction to board3
3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
JB
TBD
22
C/W
Junction to case4
4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
JC
TBD
12
C/W
Junction to top of package1,5
5 Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written in conformance with Psi-JT.
jt
TBD
2
C/W
Maximum operating junction temperature
Tj
105
oC
TJ
TA
PD JMA
+
=
PD
K
TJ 273C
+
---------------------------------
=
KPD
TA 273C
Q
JMA
PD
2
+
=
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